What You Need To Know About Surface Mount Technology
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What You Need To Know About Surface Mount Technology

Surface-mount technology was formerly known as ‘planar mounting’, and it was first used in the 1960s by IBM. The technology was leveraged to develop small-scale computers and was eventually adopted in the guidance systems in the space program.

Surface-mount technology harnesses electronic circuits where the components are mounted directly mounted onto the printed circuit boards, offering surface-mount devices. This technology is used to replace the through-hole via wire lead component construction. Many elements for SMT are commonly known as the surface-mount devices, which are lighter and smaller than their counterparts as they have smaller leads, short pins.

What Are The Devices Used in Surface Mount PCB Assembly?

Surface mount PCB assembly elements are different from the leaded counterparts. Instead of being designed for wiring, the SMT components are generated to be positioned on the board and soldered to it.

The leads do not move through holes present within the board that you might expect in a conventional leaded component. Moreover, there are various package styles for different forms of components. The style of the packages are implemented into three segments that include transistors and diodes, passive components, and integrated circuits. Let’s understand each component in detail –

  • Integrated Circuits

There is a wide range of packages that are used for integrated circuits. The package used is based on the interconnectivity level required in a project. Chips such as basic logic chips may need 14 or 16 pins whereas others like the VLSI processor as well as associated chips may need up to 200 pins or more. Considering the diversity of the project requirements, there is a wide range of packages available.

  • Transistors And Diodes

SMT transistors, as well as SMT diodes, come with a small package made of plastic. Connections are developed through leads that exudes within the package. They are also curved so they are connected to the board. In this, the leads are utilized for such packages. This way, it becomes easier to determine which way the device would move around.

  • Passive SMTs

There are different types of the package used for passive SMTs. But a lot of passive SMTs are either the SMT capacitors or the SMT resistors for which the size of the packages is relatively well standardized. Other elements include crystals, coils, and others tend to have more individual requirements.

Capacitors, as well as resistors, have a form of package sizes. These designations include 0201, 0402, 0603, 0805, 1206, and 1812. The figures are defined as the dimensions in hundreds of an inch.

Benefits Of Surface-Mount Technology

Smaller size, as well as the reduced weight, are the two benefits of SMT. Components can be aligned closer together as well as end products will be lightweight and compact. Below are the SMT benefits –

  • Smaller-sized SMTs or elements have lower costs in comparison to their larger through-hole versions.
  • The solder surface tension moves the components into alignments with solder pads. This reduces the errors related to placement.
  • You can amalgamate through-hole as well as SMT manufacturing on the same board for higher functionality.
  • The design standardization and components allow the fabrication to be automated.
  • Smaller deliverables featuring the lower lead induction offer a small radiation loop area for efficiency.

Final Thoughts

Evidently, technology has a lot of use in various applications. To get the most out of Surface-Mount Technology, you need to choose a reliable supplier.