
HDI PCB
Printed circuit boards with high-density interconnection, or HDI, have more wiring per unit space than conventional printed circuit boards. As more components are crammed into a smaller area, PCBs created utilising high-density interconnect (HDI) techniques typically have a reduced overall footprint. A HDI PCB can fit more elements into a smaller space by using micro, blind, and buried vias, vias in chips, and extremely thin traces. When scientists started looking for ways to make PCB vias smaller in 1980, high density interconnect (HDI) printed circuit boards production and fabrication began.
Manufacturing Process
The conventional PCB manufacturing process entails a lot of phases, however HDI PCB production uses several special steps that may not be employed in other boards. Like many other procedures, the HDI board design process begins with the
- Either use the largest BGA components on the board or use the interface + orientation counts from the biggest IC on the board to calculate the number of layers necessary to route all signals.
- Speak with your fabrication company to choose materials and get dielectric information for your PCB stackup.
- Identify the via pattern that will be utilised to route signals via inner layers dependent on layer counts and thickness.
- If necessary, conduct a reliability assessment to ensure that the materials won’t put too much stress on the interconnects throughout assembly processing and functioning.
- To enable reliable manufacture and assembly, establish design guidelines based on pcb fabrication capabilities and reliability needs (need for tear falls, trace widths, alignments, etc.).
There are a few design and production obstacles to go beyond when designing an HDI PCB board. The following is a brief list of difficulties you could encounter when building an HDI PCB:
- Limited workspace on the board.
- Smaller parts with closer spacing.
- A greater number of components are stacked up on both sides of the PCB.
- Increased signal flight times due to longer trace routes.
- More trace routes are necessary to finish the board.