PCB Manufacturing
Viasion Technology is committed to offering the highest quality printed circuit boards at the most competitive pricing. We aim to provide customer excellence on all orders whether you need a simple prototype, mass production or a time-critical and technologically complex multi-layer printed circuit board product. We manufacture based on IPC guidelines and complies with ISO9001:2015 and RoHS/REACH standards.
Viasion manufactures PCBs with various materials including conventional FR4, high TG FR4, high frequency/high speed FR4, halogen free FR4, polyimide, high thermal conductive CEM3, aluminium/copper base, PTFE etc. PCB surface finish includes HASL,ENIG, OSP, immersion gold/tin/silver, hard gold plating, carbon ink, blue mask,
ENEPIG.
PCB Capabilities
PCB Types
- Rigid, Flex and Rigid Flex
- Blind / Buried Vias, Micro Vias, Any-Layer HDI
- Via In Pad, Conductive & Non Conductive
- Aluminum based, Copper based
- Microwave & RF
- Impedance Control
- Backplane, back drill
- Heavy Copper 20 oz
- IC Substrate PCB
Type of Material
- FR4: High TG FR4, Halogen free FR4, High Speed FR4
- Polymide: Dupont Pyralux AP/TK series, Panasonic “FELIOS” series
- Metal based: Aluminum based, Copper based, special alloys based Laird 1KA04,1KA06, Bergquist MP06503, HT0450
- Microwave & RF: Rogers RO4350, RO4003, RO3003, RT/duroid, Arlon 85N, 33N,Nelco N4000-13, Panasonic Megtron 4, Megtron 6, Taconic RF35, TUC TU872, EMC EM827
Surface finishes
- Immersion Gold (ENIG)
- Immersion Silver
- Immersion Tin
- ENEPIG
- Pb-Free HAL
- OSP
- Hard Gold Plating
- Soft Gold
- Selective Finishes
Turnaround time
- Quick turn: 1-5 days
- Prototype and mall series production: 1-2 weeks
- Mass production: 2-4 weeks
Others
- Layers counts 1-40 layers, upto 100 layers for special
- Board thickness 0.13-7.0mm
- Max. board dimensions: 21×59 inch
- Max aspect ratio: 16:1(drill >=0.2mm)
- Solder mask color: green, black, blue, red, white, grey, purple
- Silkscreen color: white, black, yellow,green
- Outline method: Routing, v-cut and punching by mold
