PCB Assembly

Viasion provides PCB all kinds of PCB assembly services, including: Thru-hole, Surface Mount (SMT), SMT & Thru-hole Mixed.
Using traditional methods and the latest equipment and processes, our experienced staff can
supply prototype through to large volume assembly. We can place many surface mount packages
including BGA, Chip Scale Packages and passives down to 0201. A high level of placement accuracy1PCB assembly, solder
joint integrity and quality is consistently achieved.

Through hole board Assembly

Our Thru-hole assembly process allows for your parts to be hand prepped, loaded and inspected on an assembly line after which they are either wave-soldered or hand soldered. All assembled boards then go through final inspection, ensuring the highest quality before delivery to you.

SMT Assembly

SMT assembly means Surface-mount technology. It is a method that the PCB components are mounted directly onto the PCB surface by high accuracy Pick & Place equipment. Of cause solder paste need to be applied on the PCB PAD first. The processes are:
  • Print solder paste on bare PCB by automated printing machine
  • Place the PCB components on the PCB by Pick & Place equipment
  • Run thought a SMT Reflow Oven with suitable reflow profile

SMT & Thru-hole Mixed

In Viasion, we use both SMT and Thru-hole technology, to meet customer’s requirements. 

PCB Assembly Capabilites

Assembly Types
  • Surface Mount (SMT)
  • Thru-hole
  • Mixed Technology (SMT/Thru-hole)
  • Single or double sided placement
  • Rigid, Flexible PCB and Rigid flex PCB Assembly
  • High pin count press fit capable
Parts Procurement
  • Turnkey PCB Components sourcing
  • Kitted/Consigned
  • Partial Turnkey
PCB Board Dimensions Available
  • Smallest size: 0.2″ x 0.2″
  • Largest size: 20” x 28″
  • No minimum order quantity
  • Engineering prototypes
  • Low cost first article
  • Mass production
  • AOI (Automated Optical Inspection
  • X-ray for BGA
  • ICT (In-circuit Test)
  • FCT (Functional Test)
Component Types
  • Passive Components as small as 0201
  • Ball Grid Arrays (BGA) as small as .35mm pitch
  • BGA, uBGA,QFN, DFN, SOP, PLCC, POP, CGA, CSP and Leadless chips
  • All kinds of passive and active components
Other Capabilities
  • Repair/Rework services
  • Mechanical Assembly
  • Electromechanical Assembly
  • Box Build Assembly
  • IC Programming, System Integration
  • Conformal coating
  • Cable and Wire Harness Assembly

    Get In Touch

    Contact Info

    Phone number

    (456) 789 10 12

    (456) 789 10 15

    Email address



    Address info

    1363-1385 Sunset Blvd Los Angeles