PCB Fabrication

PCB Assembly
PCB Fabrication

We are a leading Chinese PCB manufacturer with experienced employees, state-of-the-art technologies, professional appliances and used quality management system ISO 9001:2000 ensure that the turnkey PCB manufacturing services offered by the company are at the highest global level.

In the table below is a comprehensive list of Viasion's key custom printed circuit board manufacturing services capabilities. This list is designed to help you understand if Viasion's capabilities are a match for your design. It will also allow you to plan ahead and create your design within these capabilities so that you can be sure Viasion can produce your PCB.

The PCB production costs have risen enormously. Today's manufacturers use an advanced base and solder mask components to assemble PCBs for industrial applications. This adds to an increase in the average cost of supply. The emphasis is on reducing costs while maintaining good levels of quality. In order to minimize the cost of assembly, the PCB manufacturers are using many methods. We specialize in cheap PCB fabrication services at Viasion Technology. Consistency and cost control are of great significance for our engineers. PCB manufacturers use many different ways to minimize PCB installation costs. We are well aware of these techniques at Viasion Technology and are also specialized in manufacturing PCB boards, turnkey PCB manufacturing and PCB contract manufacturing service.

Viasion Technology is the leading cheap PCB manufacturer. The business provides a wide variety of PCB designs under one roof to PCB manufacturing service. The company complies with international PCB manufacturing requirements to provide cheap PCB manufacturing to their valuable clients. We are the leading Chinese PCB manufacturer, providing single-sided PCB, double-sided PCB, metal core PCB, and aluminum PCBs.

If you have particular specifications for custom PCB manufacturing, speak to our experts at Viasion Technology today.

PCB capabilities


Items Capabilities
FR4 FR4, High TG FR4, Halogen free FR4, high speed FR4
Polymide Dupont Pyralux AP/TK series, Panasonic “FELIOS” series
Metal based Aluminum based, Copper based,  special alloys based,
Laird 1KA04,1KA06, Bergquist MP06503, HT0450
Microwave & RF Rogers RO4350, RO4003, RO3003, RT/duroid, Arlon 85N, 33N,
Nelco N4000-13, Panasonic Megtron 4,Megtron 6,
Taconic RF35, TUC TU872, EMC EM827
Layers counts 1-40 layers
Board thickness 0.13-7.0mm
max. board size 21×59 inch
blind/buried vias mechanical drill, laser drill, stacked vias available
HDI i+N+i(i>=1),epoxy fill, copper fill,electrochemical plating
Surface treatment HAL with lead, lead free HAL, flash gold, ENIG, immersion silver,
immersion tin, OSP, hard gold plating, hard gold connector,
ENEPIG, peelable mask, carbon ink, silver ink
max. Aspect ratio Max aspect ratio: 16:1(drill >=0.2mm)
min. drill position tolerance ±2mil
PTH tolerance ±3mil
press fit hole tolerance ±2mil
NPTH tolerance ±2mil
min. drill mechanical drill: 0.15mm; laser drill: 0.1mm
back drill size 0.5-6.5mm
slot tolerance ±0.15mm
min. pad for laser drill 10mil
min. pad for mechanical drill 14mil
BGA pad >=7mil
min. PAD tolerance   +5%;  -10%
pad tolerance <=10mil: ±1.0mil
drill to trace (blind/buried via) 9mil( 2 or 3 time pressing)
drill to trace (no blind/buried via) 6mil(<= 8 layer), 8mil(<=  14 layer), 9mil(<=  28 layer)
laser drill to trace(1-3 times pressing) 6mil
outline to trace 8mil
inner layer copper separate spacing 8mil
outline to inner layer copper 8mil
chamfer to gold finger 7mil
PAD to PAD distance (ENIG) 4mil
spacing between gold fingers 6mil
PAD to PAD distance (HAL) 7mil (to main copper 10mil)
peelbale mask to PAD 16mil
silkscreen to PAD 6mil
between carbon ink 15mil
min. distance between inner layers 2mil(without blind/buried via); 5mil(with blind/buried via)
layer to layer misalignment <= 5mil
board thickness tolerance board thickness<= 1.0mm: ±0.1mm
board thickness>1.0mm: ±10%
special(no layup requirement):thickness <= 2.0mm ±0.1mm;
thickness 2.1-3.0 ±0.15mm
impedance tolerance ±5Ω(<50Ω),±10%(>= 50Ω);>=50Ω max.±5%
outline tolerance ±0.13mm, max. +/-0.1mm
outline position tolerance ±0.1mm
bow & twist 0.7%, max.0.1%
max. inner layer copper thickness 10 OZ
max. inner layer copper thickness 15OZ
min prepreg thickness 2mil(0.5oz copper)
min silkscreen width and height width: 4mil; height: 20mil
min. inner radius 0.3mm
min.V-CUT angle tolerance ±5°
min.V-CUT symmetry tolerance ±4mil
min.V-CUT remaince tolerance ±4mil
min solder mask dam 4mil(green),5mil(other color)(base cu<=1OZ)
(cu thickness 2-4OZ,need 6mil)
solder mask color green, black, blue, red, white, grey, purple
silkscreen color white, black, yellow,green
min chamfer angle tolerance ±5°
min chamfer remaince tolerance ±5mil
Max. e-testing voltage 500V
Max. e-testing current 200mA
Rigid-flex PCBs
Microwave & RF PCBs
Metal Core PCB
Blind & buried via PCB
Flexible PCB